JPS6239218B2 - - Google Patents

Info

Publication number
JPS6239218B2
JPS6239218B2 JP58233698A JP23369883A JPS6239218B2 JP S6239218 B2 JPS6239218 B2 JP S6239218B2 JP 58233698 A JP58233698 A JP 58233698A JP 23369883 A JP23369883 A JP 23369883A JP S6239218 B2 JPS6239218 B2 JP S6239218B2
Authority
JP
Japan
Prior art keywords
weight
alloy
copper
semiconductor devices
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58233698A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59145745A (ja
Inventor
Masahiro Tsuji
Michiharu Yamamoto
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Priority to JP23369883A priority Critical patent/JPS59145745A/ja
Publication of JPS59145745A publication Critical patent/JPS59145745A/ja
Publication of JPS6239218B2 publication Critical patent/JPS6239218B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
JP23369883A 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金 Granted JPS59145745A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23369883A JPS59145745A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23369883A JPS59145745A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP606182A Division JPS58124254A (ja) 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金

Publications (2)

Publication Number Publication Date
JPS59145745A JPS59145745A (ja) 1984-08-21
JPS6239218B2 true JPS6239218B2 (en]) 1987-08-21

Family

ID=16959144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23369883A Granted JPS59145745A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金

Country Status (1)

Country Link
JP (1) JPS59145745A (en])

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2178448B (en) * 1985-07-31 1988-11-02 Wieland Werke Ag Copper-chromium-titanium-silicon alloy and application thereof
JPH01119635A (ja) * 1987-10-30 1989-05-11 Ngk Insulators Ltd 導電ばね材料
US5020770A (en) * 1988-05-12 1991-06-04 Moberg Clifford A Combination of mold and alloy core pin
US4950154A (en) * 1989-07-03 1990-08-21 Moberg Clifford A Combination injection mold and sprue bushing
JPH0776397B2 (ja) * 1989-07-25 1995-08-16 三菱伸銅株式会社 Ｃｕ合金製電気機器用コネクタ
JP2529489B2 (ja) * 1991-07-09 1996-08-28 三菱電機株式会社 銅−ニッケル基合金
US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
KR0175968B1 (ko) * 1994-03-22 1999-02-18 코오노 히로노리 전자기기용 고강도고도전성 구리합금
WO2005083137A1 (en) 2004-02-27 2005-09-09 The Furukawa Electric Co., Ltd. Copper alloy

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54402A (en) * 1977-06-02 1979-01-05 Kokusai Kikou Kk Work of protecting normal plane suitable for planting and its method of construction
JPS54100257A (en) * 1978-01-25 1979-08-07 Toshiba Corp Lead frame
JPS5834536B2 (ja) * 1980-06-06 1983-07-27 日本鉱業株式会社 半導体機器のリ−ド材用の銅合金

Also Published As

Publication number Publication date
JPS59145745A (ja) 1984-08-21

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